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BTA/BTB08 and T8 Series
8A TRIACS
SNUBBERLESS , LOGIC LEVEL & STANDARD
MAIN FEATURES:
Symbol IT(RMS) V DRM/VRRM IGT (Q ) 1 Value 8 600 and 800 5 to 50 Unit A V mA
A1 A2
G
A2
A2
A2 G
A1 A2
A1
G
DPAK (T8-B)
A2
D2PAK (T8-G)
DESCRIPTION Available either in through-hole or surface-mount packages, the BTA/BTB08 and T8 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,... The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734) ABSOLUTE MAXIMUM RATINGS
Symbol IT(RMS) Parameter RMS on-state current (full sine wave)
A1 A2 G
IPAK (T8-H)
A2
A1 A2 G
A1 A2 G
TO-220AB Insulated (BTA08)
TO-220AB (BTB08)
Value Tc = 110C 8 Tc = 100C t = 20 ms t = 16.7 ms 80 84 45 Tj = 125C Tj = 125C Tj = 125C 50 4 1 - 40 to + 150 - 40 to + 125
Unit A
DPAK / D PAK IPAK / TO-220AB TO-220AB Ins.
ITSM
Non repetitive surge peak on-state current (full cycle, Tj initial = 25C) I t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range
F = 50 Hz F = 60 Hz
A
It dI/dt IGM PG(AV) Tstg Tj
tp = 10 ms F = 120 Hz tp = 20 s
As A/s A W C 1/10
September 2000 - Ed: 3
BTA/BTB08 and T8 Series
ELECTRICAL CHARACTERISTICS (Tj = 25C, unless otherwise specified)
SNUBBERLESS and LOGIC LEVEL (3 Quadrants)
Symbol Test Conditions Quadrant T810 IGT (1) V GT VGD IH (2) IL dV/dt (2) (dI/dt)c (2) VD = 12 V RL = 30 I - II - III I - II - III I - II - III MAX. MAX. MIN. MAX. I - III II VD = 67 %VDRM gate open Tj = 125C (dV/dt)c = 0.1 V/s Tj = 125C (dV/dt)c = 10 V/s Without snubber Tj = 125C Tj = 125C MIN. MIN. MAX. 15 25 30 40 5.4 2.8 35 50 60 400 4.5 10 10 15 20 3.5 1.5 10 T8 T835 35 TW 5 1.3 0.2 15 25 30 40 5.4 2.8 35 50 60 400 4.5 50 70 80 1000 7 V/s A/ms BTA/BTB08 SW 10 CW 35 BW 50 mA V V mA mA Unit
VD = VDRM RL = 3.3 k Tj = 125C IT = 100 mA IG = 1.2 IGT
STANDARD (4 Quadrants)
Symbol Test Conditions Quadrant BTA/BTB08 C IGT (1) V D = 12 V VGT VGD IH (2) IL dV/dt (2) V D = VDRM RL = 3.3 k Tj = 125C IT = 500 mA IG = 1.2 IGT V D = 67 %VDRM gate open Tj = 125C Tj = 125C I - III - IV II MIN. MIN. RL = 30 I - II - III IV ALL ALL MAX. MAX. MIN. MAX. MAX. 25 40 80 200 5 25 50 1.3 0.2 50 50 100 400 10 V/s V/s B 50 100 mA V V mA mA Unit
(dV/dt)c (2) (dI/dt)c = 3.5 A/ms
STATIC CHARACTERISTICS
Symbol VTM (2) Vto (2) Rd (2) I DRM I RRM
Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1
Test Conditions ITM = 11 A tp = 380 s Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C MAX. MAX. MAX. MAX.
Value 1.55 0.85 50 5 1
Unit V V m A mA
Threshold voltage Dynamic resistance VDRM = VRRM
2/10
BTA/BTB08 and T8 Series
THERMAL RESISTANCES
Symbol Rth(j-c) Junction to case (AC) Parameter DPAK / D PAK IPAK / TO-220AB TO-220AB Insulated R th(j-a) Junction to ambient S = 1 cm S = 0.5 cm D PAK DPAK TO-220AB TO-220AB Insulated IPAK
S = Copper surface under tab
Value 1.6 2.5 45 70 60 100
Unit C/W
C/W
PRODUCT SELECTOR
Voltage (xxx) Part Number 600 V BTA/BTB08-xxxB BTA/BTB108-xxxBW BTA/BTB08-xxxC BTA/BTB08-xxxCW BTA/BTB08-xxxSW BTA/BTB08-xxxTW T810-xxxB T810-xxxH T835-xxxB T835-xxxG T835-xxxH
BTB: non insulated TO-220AB package
Sensitivity 800 V X X X X X X X X X X X 50 mA 50 mA 25 mA 35 mA 10 mA 5 mA 10 mA 10 mA 35mA 35 mA 35 mA X X X X X X X X X X X
Type Standard Snubberless Standard Snubberless Logic level Logic level Logic level Logic level Snubberless Snubberless Snubberless
Package TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB DPAK IPAK DPAK D PAK IPAK
3/10
BTA/BTB08 and T8 Series
ORDERING INFORMATION
BT A 08 TRIAC SERIES INSULATION: A: insulated B: non insulated CURRENT: 8A
600
BW
SENSITIVITY & TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS C: 25mA STANDARD CW: 35mA SNUBBERLESS SW: 10mA LOGIC LEVEL TW: 5mA LOGIC LEVEL
VOLTAGE: 600: 600V 800: 800V
T
TRIAC SERIES CURRENT: 8A
8
10
-
600 B
PACKAGE: B: DPAK G: D2PAK H: IPAK
(-TR)
VOLTAGE: 600: 600V 800: 800V SENSITIVITY: 10: 10mA 35: 35mA
PACKING MODE: Blank: Tube -TR: DPAK / D2 PAK Tape & Reel
OTHER INFORMATION
Part Number BTA/BTB08-xxxyz T8yy-xxxB T8yy-xxxB-TR T8yy-xxxH T8yy-xxxG T8yy-xxxG-TR Marking BTA/BTB08xxxyz T8yyxxx T8yyxxx T8yyxxx T8yyxxx T8yyxxx Weight 2.3 g 0.3 g 0.3 g 0.4 g 1.5 g 1.5 g Base quantity 250 75 2500 75 50 1000 Packing mode Bulk Tube Tape & reel Tube Tube Tape & reel
Note: xxx = voltage, yy = sensitivity, z = type
4/10
BTA/BTB08 and T8 Series
Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle).
P (W) 10 9 8 7 6 5 4 3 2 1 0
Fig. 2-1: RMS on-state current versus case temperature (full cycle).
IT(RMS) (A) 10 9 8 7 6 5 4 3 2 1 0
BTB/T8
BTA
IT(RMS)(A)
Tc(C) 0 25 50 75 100 125
0
1
2
3
4
5
6
7
8
Fig. 2-2: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35m),full cycle.
IT(RMS) (A) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 Tamb(C) 50 75 100 125
DPAK (S=0.5cm 2 ) D2PAK (S=1cm2 )
Fig. 3: Relative variation of thermal impedance versus pulse duration.
K=[Zth/Rth] 1E+0
Zth(j-c) DPAK/IP AK Zth(j-a)
1E-1
TO-220AB/D PAK Zth(j-a)
1E-2
1E-3 1E-3
tp(s)
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
Fig. 4: values).
ITM (A) 100
On-state
characteristics
(maximum
Fig. 5: Surge peak on-state current versus number of cycles.
ITSM (A)
Tj max. Vto = 0.85 V Rd = 50 m
Tj=Tj max
10
Tj=25C
VTM(V)
1 0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
90 80 70 60 50 40 30 20 10 0
t=20ms
One cycle
Non repetitive Tj initial=25C Repetitive Tc=100C
Number of cycles 1 10 100 1000
5/10
BTA/BTB08 and T8 Series
Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of I t.
ITSM (A),I t (A s) 1000
Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values).
IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25C] 2.5
Tj initial=25C
2.0
dI/dt limitation: 50A/s
IGT
ITSM
1.5 100
It
IH & IL
1.0 0.5
tp (ms)
Tj(C) 1.00 10.00 0.0 -40 -20 0 20 40 60 80 100 120 140
10 0.01
0.10
Fig. 8-1: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). Snubberless & Logic Level Types
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.2 2.0 TW 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 (dV/dt)c (V/s) 0.2 0.0 0.1 1.0 10.0
Fig. 8-2: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). Standard Types
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.0 1.8 1.6 1.4
B C
T835/CW/BW
1.2 1.0 0.8 0.6
100.0 (dV/dt)c (V/s)
T810/SW
0.4 0.1
1.0
10.0
100.0
Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature.
Fig. 10: DPAK and D2PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 m).
Rth(j-a) (C/W) 100 90 80 70 60 50 40 30 20 10 0
(dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 3 2 1 0 0 25
Tj(C)
DPAK
D PAK
S(cm ) 0 4 8 12 16 20 24 28 32 36 40
50
75
100
125
6/10
BTA/BTB08 and T8 Series
PACKAGE MECHANICAL DATA DPAK (Plastic)
DIMENSIONS REF. Millimeters Min. A A1 A2 B B2 C C2 D E G H L2 L4 R V2 Max Min. Inches Max.
R
R
2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0.2 typ. 0 8
0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0.007 typ. 0 8
FOOTPRINT DIMENSIONS (in millimeters) DPAK (Plastic)
6.7
6.7
3 3 1.6 2.3 2.3 1.6
7/10
BTA/BTB08 and T8 Series
PACKAGE MECHANICAL DATA D PAK (Plastic)
DIMENSIONS
A E L2 C2
REF.
Millimeters Min. Typ. Max. 4.60 2.69 0.23 0.93 Min.
Inches Typ. Max. 0.181 0.106 0.009 0.037 0.055 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8 0 8
D L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R
A A1 A2 B B2 C C2 D E G L L2 L3 R V2
4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0
1.40
0.169 0.098 0.001 0.027 0.048 0.60 0.017 1.36 0.047 9.35 0.352 10.28 0.393 5.28 0.192 15.85 0.590 1.40 0.050 1.75 0.055
0.40
FOOTPRINT DIMENSIONS (in millimeters) D PAK (Plastic)
16.90
10.30 1.30
5.08
3.70 8.90
8/10
BTA/BTB08 and T8 Series
PACKAGE MECHANICAL DATA IPAK (Plastic)
DIMENSIONS REF. Millimeters Min.
A E B2 L2 C2
Inches Min. 0.086 0.035 0.027 0.025 0.204 0.035 Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.033 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.031 0.039 10
Typ.
Max. 2.4 1.1 1.3 0.9 5.4 0.85
D
H L
L1
B6
B3 B V1 A1
B5 G
C A3
A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 V1
2.2 0.9 0.7 0.64 5.2 0.3 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 10
0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1
0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031
9/10
BTA/BTB08 and T8 Series
PACKAGE MECHANICAL DATA TO-220AB Ins.
DIMENSIONS
B b2 C
REF.
Millimeters Min. Typ. 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.80 16.40 2.65 1.14 1.14 2.60 14.00 10.40 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 16.80 2.95 1.70 1.70 0.511 0.393 0.024 0.048 0.173 0.019 0.094 0.094 0.244 0.147 0.622 0.104 0.044 0.044 Max. Min.
Inches Typ. 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.646 0.661 0.116 0.066 0.066 0.102 Max. 0.625
L F I A
l4
a1
c2
l3 l2 a2
b1 e
M c1
A a1 a2 B b1 b2 C c1 c2 e F I I4 L l2 l3 M
15.20
15.90 0.598
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 2000 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Swit zerland - United Kingdom http ://www.st.com
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